Samsung Announces New 3D Integration Technology X-Cube

South Korean technology giant Samsung3D IC packaging technology for use in processes requiring high performance and bandwidth eXtended-Cube (X-Cube) announced that it has become available. X-Cube uses Samsung's own TSV technology; The new generation connection technology 5G can be used in applications that require high computing power, such as artificial intelligence and wearable or mobile devices.

Built with the 7nm process, the X-Cube test chip provides engineers with greater flexibility SRAMTo stack on top of the logic unit from TSV technology It makes it possible to fit more memory into a smaller space. X-Cube significantly increases performance as it minimizes the signal distance between memory units.

Moonsoo Kang, vice president of Samsung Industrial Market Strategies department, in his statements about X-Cube “Samsung's new 3D integration technology“provides reliable TSV connections even with the latest EUV processes.” He said and stated that they are working on more innovations for 3D IC technology.

Although Samsung has currently built the X-Cube on 7nm architecture, 5nm architecture also supports. In addition, Samsung stated that it will continue to cooperate with its global partners to further spread 3D IC solutions. Samsung reveals more about X-Cube 16-18 August He stated that he will share it at an online event to be held on .

Video released by Samsung for X-Cube